Semiconductor Market Opens Door to Global Expansion

Australian tech innovator Nanoveu (ASX:NVU) has locked in a strategic $2 million placement to accelerate the commercial rollout of its ECS-DoT chip and EMASS modular AIoT platform – two technologies that sit at the heart of next-gen edge computing and smart device development.

The funding comes at a pivotal moment for Nanoveu, as the company finalises the tape-out of its cutting-edge 16 nanometre (nm) ECS-DoT System-on-Chip (SoC) and pushes into live drone trials, showcasing real-world applications of its ultra-low-power semiconductor capabilities.

Placement Follows Investor Momentum on 16nm Breakthrough

Nanoveu received strong support from both existing and new sophisticated investors, who were encouraged by recent announcements around the ECS-DoT chip’s 16nm architecture and the launch of EMASS’s development kit.

Executive Chairman Dr David Pevcic noted that this was a “pivotal moment” for the company, as it transitions from development into scalable commercialisation.

“Interest we’ve seen following the 16nm SoC announcement has been exceptional and this funding enables us to finalise key milestones, including the tape-out of our 16nm chip and broader rollout of EMASS’s AIoT platform,” he said. 

Funds to Drive Chip Tape-Out, Aiot Expansion and Field Testing

The $2 million capital raise – secured at an issue price of $0.055 per share – is designed to advance multiple areas of Nanoveu’s commercialisation roadmap. Specifically, proceeds will fund:

• Finalisation of the 16nm ECS-DoT chip tape-out
• Broader rollout of the EMASS modular AIoT platform
• Phase 2 live drone trials
• Commercial activities for EyeFly3D glasses-free 3D technology
• Ongoing field testing of Nanoshield Solar in Morocco and the UAE
• General working capital to support growth.

Drone Trials Aim for 70% Flight Improvement

Nanoveu’s structured drone program is also progressing into its second phase, targeting performance improvements of up to 70% in simulated endurance under diverse environmental conditions. Earlier testing demonstrated a 33% increase in simulated flight time.

Positioned For Dual-Listing and Global Reach

In parallel with these technical milestones, Nanoveu is also preparing for a dual listing on the U.S. OTCQB Market, supporting its international growth strategy and expanding access to global investors.

The strengthened balance sheet, combined with early traction across its ECS-DoT, EyeFly3D, and Nanoshield divisions, positions Nanoveu to capitalise on major trends in AI-driven edge computing, renewable energy tech, and digital 3D visualisation.

Placement Priced at Premium to Key VWAP Metrics

The $0.055 per share placement price represents a:

• 6.78% discount to the last traded price ($0.059)
• 4.33% premium to the 5-day VWAP
• 10.32% premium to the 10-day VWAP
• 12.39% premium to the 15-day VWAP

The deal, led by Evolution Capital and 62 Capital, also includes 10 million options (5 million listed, 5 million unlisted) for lead manager services.

Settlement of the new shares is expected on or around 22 July 2025, with options to be issued shortly thereafter.

Next Steps: Commercialisation on All Fronts

With silicon in hand for its 22nm generation and 16nm now entering fabrication, Nanoveu is entering a critical phase where chip development, AIoT platform integration, and real-world product deployment are converging.

“This is a pivotal moment in our journey toward scalable commercial deployment. We look forward to updating shareholders on our continued progress,” Pevcic added, underscoring the company’s intention to establish a foothold in the rapidly evolving smart tech and semiconductor space.

Nanoveu’s focus is now firmly on bringing its advanced, modular solutions to market – solutions aimed at transforming how industries engage with artificial intelligence, visual media, and clean technology at the edge.